The Next Platform

“Milan-X” 3D Vertical Cache Yields Epyc HPC Bang For The Buck Boost

March 21, 2022 Timothy Prickett Morgan HPC Comments Off on “Milan-X” 3D Vertical Cache Yields Epyc HPC Bang For The Buck Boost Last fall ahead of the SC21 supercomputing conference, AMD said it was ...
Business Wire

Samsung Starts Mass Producing Industry’s First 3D Vertical NAND Flash

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first ...
University of Dayton

Senior Design Project Creates Unique Vertical 3D Printer for Local Organization

Senior mechanical engineering students Jacob Shupe, Ian Smith, Colin McAndrew and Lucas Elmore were tasked with creating a vertical 3D printer for their senior design project. Their sponsor, Heart of ...
Semiconductor Engineering

A Machine-Learning-Resistant 3D PUF with 8-layer Stacking Vertical RRAM and 0.014% Bit Error Rate Using In-Cell Stabilization Scheme for IoT Security Applications

Multi-layer 3-dimensional (3D) vertical RRAM (VRRAM) PUF with in-cell stabilization scheme to improve both cost efficiency and reliability. The proposed PUF features excellent resistance against ...
HotHardware

AMD Talks Zen 4, Demos Killer Stacked 3D V-Cache For 15% Performance Boost

AMD made quite the splash during its keynote at Computex 2021. In addition to launching a new Radeon RX 6000M mobile series based on its RDNA 2 graphics architecture, the biggest surprise came in ...
The Financial

Samsung Starts Mass Producing Industry’s First 3D Vertical NAND Flash

The FINANCIAL — Samsung Electronics Co., Ltd. has begun mass producing the industry’s first three-dimensional (3D) Vertical NAND (V-NAND) flash memory, which breaks through the current scaling limit ...