SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the ...
Experts at the Table: Semiconductor Engineering sat down to talk about how to inspect and measure smaller features across large areas in advanced packaging, with Frank Chen, director of applications ...
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging (I-Cube) ...
SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a ...
The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands SUNNYVALE, Calif.--(BUSINESS WIRE)--Alpha and Omega ...
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...
Heterogeneous integration is a key enabler of today’s AI innovations. By bringing together multiple chips with different functionalities, a.k.a., chiplets, AI devices have been able to achieve ...
Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback