Teradyne Inc. recently introduced the newest member of its next-generation Optima 7000-Series of automated optical inspection systems. Launched at the annual IPC – Association Connecting Electronics ...

A new technical paper titled “A Universal AI-Powered Segmentation Model for PCBA and Semiconductor” was published by researchers at Nordson Corporation. “This paper introduces a novel universal deep ...

Driven by the continued decrease in the size of electronics packaging, combined with the increase in density, there is a critical need for highly accurate 3D inspection for defect detection. Using ...

In this interview, Tim Skunes from CyberOptics Corporation talks to AZoM about their 3D optical inspection technology, and how it can be used to solve challenges in SMT electronics manufacturing.

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