NUREMBERG, Germany--(BUSINESS WIRE)--PCIM Europe – Power Integrations (NASDAQ: POWI), the leader in gate driver technology for medium- and high-voltage inverter applications, today announced the SCALE ...

The following article was originally published in eeNews Automotive. It is reprinted here with permission. Belgian company Cissoid has launched a three-phase silicon-carbide (SiC) intelligent power ...

Addressing two of the major barriers for electric vehicle (EV) adoption, charging time and the range a vehicle can travel before charging, onsemi has announced the APM32 series of silicon-carbide- ...

Car manufacturers have long been investing in building up their automotive chip supply chain, and the power module sector has been attracting major investment from them. Auto makers in China are ...

STMicroelectronics has introduced five silicon carbide (SiC) MOSFET-based high-power modules for electric vehicles (EV) that improve performance and driving range. The new SiC power modules cover a ...

Li Auto broke ground recently on its power semiconductor R&D and production base in Suzhou, China, a milestone for the electric vehicle (EV) maker. The move is a strategic one, which will allow Li ...

As more power electronic devices find their way into electrical racing vehicles, semiconductor companies and automakers partner up to develop better wideband-gap devices. Semiconductor companies are ...

KYOTO, Japan, April 24, 2025 /PRNewswire/ -- ROHM Co., Ltd. has developed new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package for power-factor-correction (PFC) circuits and LLC-resonant ...

Cissoid is broadening its range of standard products with multiple new families of power modules. Designed to address the growing demand for robust, efficient, and flexible solutions in automotive, ...

Santa Clara, CA and Kyoto, Japan, Oct. 27, 2021 (GLOBE NEWSWIRE) -- Zhenghai Group Co., Ltd. (Zhenghai Group) and ROHM Co., Ltd. (ROHM) have signed a joint venture agreement to establish a new company ...

Santa Clara, CA and Kyoto, Japan, April 24, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for ...