Electron-beam inspection is proving to be indispensable for finding critical defects at sub-5nm dimensions. The challenge now is how to speed up the process to make it economically palatable to fabs.

The IC industry is making a giant leap from planar devices to a range of next-generation architectures, such as 3D NAND and finFETs. But it’s taking longer than expected to ramp up these new ...

Maintaining alignment requires regular monitoring, and SKF’s TKSA laser-guided shaft alignment systems are designed for novices as well as experienced users, with built-in procedures that cover ...