Intel Corp. today showcased a new class of Intel Core Ultra X9 and X7 processors, the first new chips built on its most ...

A new chip manufacturing process from Intel Corp. failed to meet Broadcom Inc.’s expectations in a recent evaluation, Reuters reported today. The development may mark a setback for Intel’s foundry ...

The chiplet model has been proven by the early adopters. Large companies that successfully developed chips at leading nodes have integrated multiple chiplets into systems, where the entire silicon ...

Taiwanese semiconductor foundry TSMC has announced its most advanced process technology called A16. Scheduled to enter production in the second half of 2026, it is the company’s 1.6nm production node.

TSMC has announced a breakthrough chip fabrication technology, with reduced node size, increased performance and better power management — all of which should ultimately lead to faster iPhones and ...

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

Apple is reportedly in exploratory conversations with at least one partner to potentially handle iPhone chip assembly and packaging in India for the first time. Here are the details. According to The ...

Apple’s India story may be entering a more consequential phase—one that moves beyond assembling devices to shaping what goes inside them. As first reported by The Economic Times, Apple is in early ...