Under the Department of Commerce, the program will provide funding for research and development projects to support U.S. semiconductor advanced packaging and strengthen the manufacturing and packaging ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (AMKR), a leading provider of semiconductor packaging and test services, today announced revised plans for the location of the company’s new ...

Foxconn Chairman Liu Young-way revealed on September 4, 2024, that in addition to their existing investments in IC design and applications, the company is currently evaluating the possibility of ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...

Companies and governments invested heavily in onshoring fabs and facilities over the past 12 months as tariffs threatened to ...

GlobalFoundries has signed a Memorandum of Understanding with Singapore's Agency for Science, Technology and Research (A*STAR) to enhance its advanced packaging capabilities in response to the growing ...

As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor ecosystem.

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...