The IC industry has been on a mission to pare down older capacity (i.e. ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. In its recently released Global Wafer ...
HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.
Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...
The IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. In its recently released Global Wafer ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
March 15, 2003 - Following UNITED MICROELECTRONICS CORP. investing FARADAY TECHNOLY, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (TSMC) gained operational control of Global UniChip Corp.
Nine new 300mm wafer fabs scheduled to open in 2019, five of them in China IC Insights recently released its Global Wafer Capacity 2019-2023 report that provides in-depth analyses and forecasts of IC ...
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