Business Wire

Samsung Introduces Chip-on-Board LED Packages with Small LES and Advanced Color Quality

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, has introduced new chip-on-board (COB) LED package lineups, including small LES ...
Business Wire

Samsung Introduces Versatile New Flip Chip LED Packages and Modules

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
EDN

Samsung introduces LED components based on chip-scale packaging technology

Samsung Electronics introduced a full line-up of chip-scale LED packages (CSP), including 0.6-W-class and 3-W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung’s CSP technology ...
EDN

The three Ps of LED driver selection: power, package, and performance

Advances in technology have resulted in LEDs with exceptional lumen output and years of reliable operation. All LED lighting systems — regardless of the size and complexity of the luminaire design — ...