Yahoo Finance

LED Packaging Market Projected to Reach USD 19.4 Billion by 2029, Boosted by UV LED and Smart Lighting Applications

DUBLIN, March 20, 2024 /PRNewswire/ -- The "Global LED Packaging Market by Package Type (SMD, COB, CSP), Power Range (Low-&Mid-Power LED Packages, High-Power LED Packages), Wavelength (Visible & ...
Yahoo Finance

Worldwide LED Packaging Industry to 2026 - Growing Preference Towards UV LED-based Curing Systems Presents Opportunities

Dublin, March 04, 2022 (GLOBE NEWSWIRE) -- The "Global LED Packaging Market (2021-2026) by Application Type, LED Packaging Type, Power Range Type, Wavelength Type, Packaging Type, Geography, ...
Digi Times

Equipment supplier Contrel secures orders for microLED, panel-level packaging

Contrel Technology, an LCD equipment specialist, has received orders for microLED and panel-level packaging from Taiwan's top-two panel makers, AUO and Innolux, which will drive revenue growth in 2024 ...
Digi Times

Equipment supplier gives hints at FOPLP development progress among Taiwanese companies

Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel manufacturers, and ...
Mena FN

Panel Level Packaging Market Size To Hit USD 3.41 Billion By 2032, Driven By Demand For Advanced, Compact Semiconductor Solutions | SNS Insider

(MENAFN- GlobeNewsWire - Nasdaq) Panel Level Packaging Market growth is driven by miniaturization in electronics, 5G and AI demand, cost efficiency, and adoption in automotive and consumer devices.