August 26, 2014. Today, KLA-Tencor Corp. introduced the WaferSight PWG patterned wafer geometry measurement system, the LMS IPRO6 reticle pattern placement metrology system and the K-T Analyzer 9.0 ...
Chipmakers are ramping up 16nm/14nm finFET processes, with 10nm and 7nm now moving into early production. But at 10nm and beyond, chipmakers are running into a new set of problems. While shrinking ...
The overlay metrology equipment market is heating up at advanced nodes as the number of masking layers grows and the size of the features that need to be aligned continue to shrink. Both ASML and ...
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