Morningstar

Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor ...

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing.
Digi Times

Powertech secures full FOPLP bookings ahead of US$1B expansion

Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's advanced ...
Digi Times

Greatek sees 2Q25 growth but faces currency erosion; flip-chip capacity expansion to complete by 1H26

Benefiting from a tariff buffer period, customers actively stocked up in advance. Powertech Technology Inc. (PTI)'s invested testing and packaging subsidiary, Greatek Electronics, reported ...
Seeking Alpha

Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor ...

The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%. Nordson’s industry-leading ASYMTEK Vantage® Series fluid ...