SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the ...

Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field.

Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging (I-Cube) ...

The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands SUNNYVALE, Calif.--(BUSINESS WIRE)--Alpha and Omega ...

Heterogeneous integration is a key enabler of today’s AI innovations. By bringing together multiple chips with different functionalities, a.k.a., chiplets, AI devices have been able to achieve ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...

Sony has announced that it’s Ci Media Cloud has launched a new Advanced Watermark Security package that is designed to protect high-value content. The offering is available as an add-on with ...

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

New Holland has introduced new advancements in its precision technology stack. FieldOps, Technology Packages, Connectivity Included and New Holland Active Implement Guidance become part of New Holland ...