Instruction Alignment in Large Language Models for Chip Design via Geodesic Interpolation” was published by researchers at ...

A new technical paper titled “Leveraging ASIC AI Chips for Homomorphic Encryption” was published by researchers at Georgia ...

A new technical paper titled “Superconductivity from Domain Wall Fluctuations in Sliding Ferroelectrics” was published by ...

A new research paper titled “Thickness-dependent polaron crossover in tellurene” was published by researchers from Rice ...

But it could help with mundane tasks, freeing up designers to focus on more intricate problems.

Traditional 2D EDA flows are insufficient for multi-die designs, requiring advanced parasitic extraction, power analysis, and ...

Despite the buzz, a study of 500 technology professionals in the data center field revealed only 42% are up to speed with ...

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how ...

Examples of how Intel and Google used Calibre DesignEnhancer to enhance their design flows, boost power integrity, and achieve superior IC designs faster. The importance of a flexible, ...

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, with one company developing RISC-V AI processor IP bringing in nearly $700 ...

From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...

Global semiconductor sales hit $57.8 billion in November 2024, an increase of 20.7% compared to the same month last year, according to the Semiconductor Industry Association. Special Report: What’s ...