CSignum, a provider of technology extending IoT communications underwater and underground, secures £6m in new funds.

It looks like Samsung will shortly end the production of 1z nm 8Gb LPDDR4, due to intense Chinese competition. Reports ...

Introduced last year the RA0 MCU series has been adopted by a wide range of customers due its affordability and low power ...

By incorporating training data from Japan’s complex road environments, Wayve will be able to strengthen the generalisation of ...

VeriSilicon launches the GCNano3DVG, a new ultra-low power graphics processing unit (GPU) IP for wearable devices.

Weak economic growth and excess inventory, it's been a tough 2024 for distributors. Now Trump’s tariffs add to the mix.

Hirose Electric has launched what it claims is one of the industry’s smallest back flip FPC connectors for automotive and other harsh environment applications.

STMicroelectronics has announced Stellar with xMemory, a new generation of extensible memory embedded into its Stellar series ...

The JEDEC Solid State Technology Association, the global developer of standards for the microelectronics industry, has ...

Cadence to acquire Arm's Artisan foundation IP business, consisting of cell libraries, memory compilers, and GPIOs.

In response, Infineon Technologies is developing a new generation of high-voltage automotive IGBT chip products. Among these ...

OLED’s share of OLED monitor shipments is expected to rise from 68% in 2024 to 73% in 2025, highlighting its strong ...