IEEE

Optimizing Plasma Etching: Integrating Precise Three-Dimensional Etching Simulation and Machine Learning for Multi-Objective Optimization

Abstract: In modern semiconductor manufacturing, optimizing plasma etching processes is key for advancing technology and achieving profitable production. In this study, we propose an efficient process ...
IEEE

Highly manufacturable Self-Aigned Direct Backside Contact (SA-DBC) and Backside Gate Contact (BGC) for 3-dimensional Stacked FET at 48nm gate pitch

Abstract: In this study, we have demonstrated 3-Dimensional Stacked FET (3DSFET) with Self-Aligned Direct Back-side Contact (SA-DBC) and Back-side Gate Contact (BGC) in 48nm gate pitch, which is the ...

Em 2004, a IBM se gabava de possuir o supercomputador mais poderoso do mundo; mais de 20 anos depois, uma única placa de vídeo RTX o destruiu completamente

Em 2004, a IBM se gabava de possuir o supercomputador mais poderoso do mundo; mais de 20 anos depois, uma única placa de ...
SciELO

Dimensional stability of 3D-printed models for orthodontic aligners: a six-month storage evaluation

Objective: This study aimed to analyze the dimensional stability of 3D resin-printed models for orthodontic aligners under specific storage conditions over a period of up to six months. Methods: A ...