Samsung’s JB Park on Why India Is Central to Its AI Strategy

Mr.Park expressed strong optimism about 2026, pointing to CES as the starting point and the flagship launch in February as a ...
Tech.eu

Reinventing the light switch as Europe’s missing energy interface

How London-based Tewke is turning the most familiar object in the home into a gateway for demand-side energy control, ...
Electronic Design

Embedded Virtualization: From Concept to Implementation—A Case Study

Virtualization helps overcome the limitations of traditional test systems. By consolidating multiple PCs into a single ...
EDN

The shift to 800-VDC power architectures in AI factories

AI factories meet the computational capacity and power requirements of today’s machine-learning and generative AI workloads.

The future of wearables: Computer chips you can weave, wash, and wear

Traditional chips depend on flat, inflexible wafers; the Fudan team replaced these with elastic substrates capable of hosting resistors, capacitors, diodes, and transistors. Once patterned, each ...
Semiconductor Engineering

Balancing Training, Quantization, And Hardware Integration In NPUs

Evolving challenges and strategies in AI/ML model deployment and hardware optimization have a big impact on NPU architectures ...
Hackaday

Embedded TPM: Watch Out!

Today’s PCs are locked up with Trusted Platform Module (TPM) devices so much so that modern Windows versions insist on having ...
FMIBlog

Chiplet Architectures and Advanced Packaging Redefine the U.S. Semiconductor Assembly and Testing Industry

U.S. semiconductor companies were among the first to respond by disaggregating large chips into smaller, specialized chiplets ...