Abstract: Ruthenium (Ru) and Copper (Cu) interface promotes void-free Cu gap-fill through a Cu reflow approach. However, reliability issues such as Electromigration (EM) and time-dependent dielectric ...
Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration
Abstract: Integration of thermal atomic layer deposition (ALD) TaN films modified by physical vapor deposition post-treatment (PPT) and in-situ plasma treatment (IPT) was investigated on 36nm pitch ...
This is the benchmark suite for liner shipping network design described in "Brouer, Berit D.; Alvarez, J. Fernando; Plum, Christian Edinger Munk; Pisinger, David; Sigurd, Mikkel M. A base integer ...
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Love is in the air! Whether you're a fan of Valentine's Day or are biding your time until Feb. 15, we're here to add a little humor to the February holiday with this collection of Valentine's Day ...
There's so much action, death, sex and violence in Game of Thrones that it's sometime easy to forget just how damn good the writing is too. To get you in the mood for the final season, we've rounded ...
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