In assessing the solder joint reliability using an accelerated thermal cycling (ATC) test methodology, which is widely used in the microelectronics industry, a common type of solder joint failure is ...

This paper investigates the water film buildup on solder masked printed circuit board assembly (PCBA) laminates under humid conditions. The effects of solder mask surface chemistry, morphology, and ...

LG Innotek looks to future tech innovations for smartphones to make them slimmer by replacing solder balls with Copper Posts, ...

LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, ...

Avalanche photodiodes (APDs) for ultra-sensitive infrared detection at eye-safe wavelengths are built around compound ...