LG Innotek looks to future tech innovations for smartphones to make them slimmer by replacing solder balls with Copper Posts, ...

LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, ...

Avalanche photodiodes (APDs) for ultra-sensitive infrared detection at eye-safe wavelengths are built around compound ...

The next-gen substrate allows for denser circuitry for smaller, higher-performance semiconductor substrates, and improved ...

Innotek recently announced a significant advancement in semiconductor substrate technology called copper post, or Cu-Post, that’s starting to be mass-produced.

In this video, I tackle the process of assembling a DIY Telecaster guitar kit amidst some technical difficulties, resulting ...

LG Innotek is continuing its quest to become the world's top company in the field of technology components, with its latest ...

Nitrogen in reflow is a tool – not a requirement. For fine-pitch work, bottom-terminated components (BTCs), low-residue ...

“For outsourced semiconductor assembly and test companies and others seeking a more simplified approach, solder and the reflow process remain the primary means of creating a known good interconnect.” ...

Welding Process Uses No Solder By Science News Magazine Issue: Vol. 78 No. #1, July 2, 1960 Having trouble viewing this? Open in a new window Questions or comments on this article?

Compulab MCM-iMX95 is yet another NXP i.MX 95 system-on-module (SoM), whose main selling point is being offered as a solder-down QFN package with SMD pads. The hexa-core Cortex-A55 Edge AI module ...

Lead-free wave soldering was studied in this work using a 95.5Sn/3.8Ag/0.7Cu alloy. A process DOE was developed, with three variables (solder bath temperature, conveyor speed, and soldering atmosphere ...